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| 55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-1603-YG Features ! 1.6mmx0.8mm ! LOW POWER ! WIDE ! IDEAL Description SMT LED, 1.1mm THICKNESS. The Mega Green source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. CONSUMPTION. VIEWING ANGLE. FOR BACKLIGHT AND INDICATOR. COLORS AND LENS TYPES AVAILABLE. : 2000PCS / REEL. ! VARIOUS ! PACKAGE 1.6x0.8mm SMD CHIP LED LAMP Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. REV NO: V.2 DATE:DEC/05/2002 PAGE: 1 OF 4 Selection Guide P ar t No.. Pa No art No. Dice ic Lens Typ L ens Ty pe ens Ty s Iv (mcd) Iv (m c d ) (mcd d @ 20mA Miin. in . n GHB-0603-YG M EGA GREEN (InGaAlP) WATER CLE AR 18 Ty p.. Typ Ty p yp 70 120 Viewing Viewin g View in i Angle Note: 1 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C Sy m b o l Sy ymbol ymbo peak D 1/2 C VF IR P ar am e t er Pa aramete P eak Wavelength D ominate Wavelength S pectral Line Half-width Capacitance Forward Voltage Reverse Current e D ev i c e evic Mega Green Mega Green Mega Green Mega Green Mega Green Mega Green Ty p.. Ty p yp 574 568 26 20 2.1 2.5 10 x Max .. ax Un its nit nm nm nm pF V uA Tes t Co n d it io ns Test Cond ition s est s IF=20mA IF=20mA IF=20mA V F =0V;f =1MHz IF=20mA V R = 5V Absolute Maximum Ratings at TA=25 C Par am et er Paramete Pa arameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Lead Solder Temperature [2] Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Mega Green eg a Gr een Gree 1 05 30 1 50 5 -40 C To +85 C 260 C For 5 Seconds U n i ts Unit nit mW mA mA V REV NO: V.2 DATE:DEC/05/2002 PAGE: 2 OF 4 REV NO: V.2 DATE:DEC/05/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.2 DATE:DEC/05/2002 PAGE: 4 OF 4 |
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